JPH01117313A - ヒューズ付きチップ状固体電解コンデンサおよびその製造方法 - Google Patents
ヒューズ付きチップ状固体電解コンデンサおよびその製造方法Info
- Publication number
- JPH01117313A JPH01117313A JP62276379A JP27637987A JPH01117313A JP H01117313 A JPH01117313 A JP H01117313A JP 62276379 A JP62276379 A JP 62276379A JP 27637987 A JP27637987 A JP 27637987A JP H01117313 A JPH01117313 A JP H01117313A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- lead terminal
- fuse wire
- cathode lead
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 51
- 239000007787 solid Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 238000007664 blowing Methods 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 229920002799 BoPET Polymers 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004332 silver Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 238000005253 cladding Methods 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62276379A JPH01117313A (ja) | 1987-10-30 | 1987-10-30 | ヒューズ付きチップ状固体電解コンデンサおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62276379A JPH01117313A (ja) | 1987-10-30 | 1987-10-30 | ヒューズ付きチップ状固体電解コンデンサおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01117313A true JPH01117313A (ja) | 1989-05-10 |
| JPH0576170B2 JPH0576170B2 (en]) | 1993-10-22 |
Family
ID=17568605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62276379A Granted JPH01117313A (ja) | 1987-10-30 | 1987-10-30 | ヒューズ付きチップ状固体電解コンデンサおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117313A (en]) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306610A (ja) * | 1989-05-22 | 1990-12-20 | Nec Corp | ヒューズ付きチップ状固体電解コンデンサ |
| JPH051218U (ja) * | 1991-06-21 | 1993-01-08 | 日本電気株式会社 | ヒユーズ内蔵チツプ形タンタルコンデンサ |
| US5478965A (en) * | 1993-02-02 | 1995-12-26 | Nec Corporation | Fused chip-type solid electrolytic capacitor and fabrication method thereof |
| US20100246099A1 (en) * | 2009-03-25 | 2010-09-30 | Rohm Co., Ltd. | Electrolytic capacitor and method of making the same |
| CN110428981A (zh) * | 2019-08-07 | 2019-11-08 | 哈尔滨师范大学 | 一种片状叠层全固态超级电容器及制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037U (ja) * | 1981-08-07 | 1983-02-17 | 松下電器産業株式会社 | 固体電解コンデンサ |
| JPS6315037U (en]) * | 1986-07-11 | 1988-02-01 |
-
1987
- 1987-10-30 JP JP62276379A patent/JPH01117313A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825037U (ja) * | 1981-08-07 | 1983-02-17 | 松下電器産業株式会社 | 固体電解コンデンサ |
| JPS6315037U (en]) * | 1986-07-11 | 1988-02-01 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02306610A (ja) * | 1989-05-22 | 1990-12-20 | Nec Corp | ヒューズ付きチップ状固体電解コンデンサ |
| JPH051218U (ja) * | 1991-06-21 | 1993-01-08 | 日本電気株式会社 | ヒユーズ内蔵チツプ形タンタルコンデンサ |
| US5478965A (en) * | 1993-02-02 | 1995-12-26 | Nec Corporation | Fused chip-type solid electrolytic capacitor and fabrication method thereof |
| US20100246099A1 (en) * | 2009-03-25 | 2010-09-30 | Rohm Co., Ltd. | Electrolytic capacitor and method of making the same |
| CN110428981A (zh) * | 2019-08-07 | 2019-11-08 | 哈尔滨师范大学 | 一种片状叠层全固态超级电容器及制备方法 |
| CN110428981B (zh) * | 2019-08-07 | 2021-02-26 | 哈尔滨师范大学 | 一种片状叠层全固态超级电容器及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0576170B2 (en]) | 1993-10-22 |
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